IC Package Types :)

The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements.  Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of course, cost.

Popular IC package types used in the semiconductor industry today are presented below.

Types of IC Packages (not shown in scale)

CBGA - Ceramic Ball Grid Array

CBGA - Ceramic Ball Grid Array

CCGA - Ceramic Column Grid Array

CCGA - Ceramic Column Grid Array

CerDIP - Ceramic Dual-in-Line Package

CerDIP - Ceramic Dual-in-Line Package

CerPack - Ceramic Package

CerPack - Ceramic Package

CLCC - Ceramic Leadless Chip Carrier

CLCC - Ceramic Leadless Chip Carrier

CPGA - Ceramic Pin Grid Array

CPGA - Ceramic Pin Grid Array

CQFP - Ceramic Quad Flat Pack

CQFP - Ceramic Quad Flat Pack

D2PAK or DDPAK - Dou-ble Decawatt Package

D2PAK or DDPAK - Dou-ble Decawatt Package

D3PAK - Decawatt Package 3

D3PAK - Decawatt Package 3

DFN - Dual Flat No Leads Package

DFN - Dual Flat No Leads Package

DPAK - Decawatt Package

DPAK - Decawatt Package

FBGA - Fine-Pitch Ball Grid Array

FBGA - Fine-Pitch Ball Grid Array

JLCC - J-Leaded Ceramic Chip Carrier

JLCC - J-Leaded Ceramic Chip Carrier

LFBGA - Low Profile Fine-Pitch Ball Grid Array

LFBGA - Low Profile Fine-Pitch Ball Grid Array

LGA - Land Grid Array

LGA - Land Grid Array

LQFP - Low-Profile Quad Flat Package

LQFP - Low-Profile Quad Flat Package

MLP - Micro Leadframe Package

MLP - Micro Leadframe Package

MQFP - Metric Quad Flat Package

MQFP - Metric Quad Flat Package

MSOP - Micro Small Outline Package

MSOP - Micro Small Outline Package

PBGA - Plastic Ball Grid Array

PBGA - Plastic Ball Grid Array

PDIP - Plastic Dual-in-Line Package

PDIP - Plastic Dual-in-Line Package

PLCC - Plastic Leaded Chip Carrier

PLCC - Plastic Leaded Chip Carrier

PPGA - Plastic Pin Grid Array

PPGA - Plastic Pin Grid Array

PQFN - Power Quad Flat No Leads Package

PQFN - Power Quad Flat No Leads Package

PQFP - Plastic Quad Flat Pack

PQFP - Plastic Quad Flat Pack

PSOP - Power Small Outline Package

PSOP - Power Small Outline Package

QFN - Quad Flat No Leads Package

QFN - Quad Flat No Leads Package

QSOP - Quarter Size Outline Package

QSOP - Quarter Size Outline Package

SBDIP - Sidebraze Dual-in-Line Package

SBDIP - Sidebraze Dual-in-Line Package

SC-70 - Small Outline Transistor

SC-70 - Small Outline Transistor

SIP - Single-In-Line Package

SIP - Single-In-Line Package

SOIC - Small Outline IC Package

SOIC - Small Outline IC Package

SOJ - Small Outline J-Lead Package

SOJ - Small Outline J-Lead Package

SOT-23 - Small Outline Transistor

SOT-23 - Small Outline Transistor

SPDIP - Shrink Plastic Dual-in-Line Package

SPDIP - Shrink Plastic Dual-in-Line Package

SSOP - Shrink Small Outline Package

SSOP - Shrink Small Outline Package

TDFN - Thin Dual Flat No Leads Package

TDFN - Thin Dual Flat No Leads Package

TFBGA - Thin Fine-Pitch Ball Grid Array

TFBGA - Thin Fine-Pitch Ball Grid Array

TQFN - Thin Quad Flat No Leads Package

TQFN - Thin Quad Flat No Leads Package

TQFP - Thin Quad Flat Pack

TQFP - Thin Quad Flat Pack

TSOP - Thin Small Outline Package

TSOP - Thin Small Outline Package

TSSOP - Thin Shrink Small Outline Package

TSSOP - Thin Shrink Small Outline Package

UTDFN - Ultra Thin Dual Flat No Leads Package

UTDFN - Ultra Thin Dual Flat No Leads Package

UTQFN - Ultra Thin Quad Flat No Leads Package

UTQFN - Ultra Thin Quad Flat No Leads Package

VFBGA - Very Thin Fine-Pitch Ball Grid Array

VFBGA - Very Thin Fine-Pitch Ball Grid Array

VSOP - Very Small Outline Package

VSOP - Very Small Outline Package

XDFN - Extreme Thin Dual Flat No Leads Package

XDFN - Extreme Thin Dual Flat No Leads Package

XQFN - Extreme Thin Quad Flat No Leads Package

XQFN - Extreme Thin Quad Flat No Leads Package

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